JPH0715137Y2 - ウエハー保持装置 - Google Patents
ウエハー保持装置Info
- Publication number
- JPH0715137Y2 JPH0715137Y2 JP1989077304U JP7730489U JPH0715137Y2 JP H0715137 Y2 JPH0715137 Y2 JP H0715137Y2 JP 1989077304 U JP1989077304 U JP 1989077304U JP 7730489 U JP7730489 U JP 7730489U JP H0715137 Y2 JPH0715137 Y2 JP H0715137Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- mounting table
- holding means
- holding
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 claims description 19
- 238000005096 rolling process Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 description 94
- 238000001020 plasma etching Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000004380 ashing Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077304U JPH0715137Y2 (ja) | 1989-06-30 | 1989-06-30 | ウエハー保持装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077304U JPH0715137Y2 (ja) | 1989-06-30 | 1989-06-30 | ウエハー保持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0317633U JPH0317633U (en]) | 1991-02-21 |
| JPH0715137Y2 true JPH0715137Y2 (ja) | 1995-04-10 |
Family
ID=31619568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989077304U Expired - Fee Related JPH0715137Y2 (ja) | 1989-06-30 | 1989-06-30 | ウエハー保持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0715137Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5318969A (en) * | 1976-08-06 | 1978-02-21 | Nippon Telegr & Teleph Corp <Ntt> | Wafer fixing method |
| JPS5963727A (ja) * | 1982-10-05 | 1984-04-11 | Toshiba Corp | 試料保持用テ−ブル装置 |
-
1989
- 1989-06-30 JP JP1989077304U patent/JPH0715137Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0317633U (en]) | 1991-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100333035B1 (ko) | 반도체 장치의 제조방법 및 반도체 장치 | |
| JPH0715137Y2 (ja) | ウエハー保持装置 | |
| US5885756A (en) | Methods of patterning a semiconductor wafer having an active region and a peripheral region, and patterned wafers formed thereby | |
| US3986876A (en) | Method for making a mask having a sloped relief | |
| US20040115957A1 (en) | Apparatus and method for enhancing wet stripping of photoresist | |
| JP2501809Y2 (ja) | ウエハ―保持装置 | |
| JPH0637050A (ja) | 半導体ウエハのドライエッチング装置 | |
| TW409313B (en) | Equipment for fabricating semiconductor devices with nozzle and spin chuck | |
| US6767692B1 (en) | Process for inhibiting edge peeling of coating on semiconductor substrate during formation of integrated circuit structure thereon | |
| US7045019B1 (en) | Method for performing site-specific backside particle and contamination removal | |
| CN110571166A (zh) | 晶边刻蚀方法和半导体器件制造方法 | |
| JPH0620903A (ja) | 半導体装置の製造方法 | |
| US20040092126A1 (en) | Method for preventing reworked photoresist from collapsing | |
| JPS61188934A (ja) | レジスト除去装置 | |
| JPS60195546A (ja) | マスク用基板 | |
| JP3485471B2 (ja) | 処理装置及び処理方法 | |
| JPH0330426A (ja) | ウエハー裏面洗浄装置 | |
| JPS6347924A (ja) | 半導体装置の製造方法 | |
| JP2000068186A (ja) | 半導体装置の製造方法 | |
| JPS586535Y2 (ja) | 回転式塗布装置 | |
| JPH0632673Y2 (ja) | レジスト塗布装置 | |
| JPH0831710A (ja) | 半導体装置の製造方法 | |
| JP2857272B2 (ja) | ウエハ上の不要レジスト露光装置 | |
| JPH05251197A (ja) | ドライエッチング方法 | |
| JPH0335239A (ja) | 半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |